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+7 (3412) 60-14-39
Business hours: 8 a.m. to 5 p.m.
RUS en
RUS en
+7 (3412) 60-14-39
Business hours: 8 a.m. to 5 p.m.

Mounting of Any and All Packaged and Uncased Electronic Components

Mounting of any and all packaged and uncased electronic components, including assembly of chips made of gallium arsenide, 0.1 mm-thick, with overall dimensions of 0.8x0.8 mm and dimensions of contact pads of from 0.06х0.06 mm.

THE MOUNTING IS PERFORMED:
➢ using jumpers made of gold and aluminium wire with diameter of (20 to 50) µm, by means of ultrasonic welding between the cell's contact pad and a current-conducting element of the substrate, with the use of HYBOND 626 and Delvotec 5630 machines;
➢ for components, by means of single-sided parallel-gap contact welding with a gold wire with diameter of (20 to 50) µm and a 20 µm-thick gold foil;
➢ for uncased components (chips), by means of eutectic brazing with the use of РР-5, РР-6 units.
Implemented Processes
THE MOUNTING IS PERFORMED:
➢ using jumpers made of gold and aluminium wire with diameter of (20 to 50) µm, by means of ultrasonic welding between the cell's contact pad and a current-conducting element of the substrate, with the use of HYBOND 626 and Delvotec 5630 machines;
➢ for components, by means of single-sided parallel-gap contact welding with a gold wire with diameter of (20 to 50) µm and a 20 µm-thick gold foil;
➢ for uncased components (chips), by means of eutectic brazing with the use of РР-5, РР-6 units.
Implemented Processes
We offer manufacture of your products according to the provided technical documentation.

The lead time depends on the project complexity.
Place an Order Right Away
We will call you back during the working day to discuss the details and calculate the cost of your project
Place an Order Right Away
We will call you back during the working day to discuss the details and calculate the cost of your project