Mounting of any and all packaged and uncased electronic components, including assembly of chips made of gallium arsenide, 0.1 mm-thick, with overall dimensions of 0.8x0.8 mm and dimensions of contact pads of from 0.06х0.06 mm.
THE MOUNTING IS PERFORMED:
➢ using jumpers made of gold and aluminium wire with diameter of (20 to 50) µm, by means of ultrasonic welding between the cell's contact pad and a current-conducting element of the substrate, with the use of HYBOND 626 and Delvotec 5630 machines;
➢ for components, by means of single-sided parallel-gap contact welding with a gold wire with diameter of (20 to 50) µm and a 20 µm-thick gold foil;
➢ for uncased components (chips), by means of eutectic brazing with the use of РР-5, РР-6 units.