About us
Production
Products
Development
News
Contacts
Search
+7 (3412) 60-14-39
Business hours: 8 a.m. to 5 p.m.
RUS en
RUS en
+7 (3412) 60-14-39
Business hours: 8 a.m. to 5 p.m.

Surface Mounting Line

Surface mounting is a technology of manufacture of PCB-based electronic products, as well as related methods for design of printed board assemblies.


To place an order, fill in the blank and attach it to the request form. Download a request blank.


The PCB surface mounting technology is also known as SMT and SMD technology, whereas components for surface mounting are also known as chip components. SMT is so far the most commonly used design and assembly method for PCB-based electronic units. The main difference between SMT and conventional technology, i.e. through-hole mounting, is that the components are mounted on surface of a PCB only at the side of wire tracks, which does not require any holes. Through-hole mounting and SMT can be combined in the same PCB. The SMT is advantageous by virtue of a combination of the component features, design methods and practices of manufacture of printed board assemblies.

The typical SMT process flow includes:

  • fabrication of a PCB;
  • application of soldering paste on the PCB contact pads:
    • paste dosing from a special-purpose syringe, manually or using a machine for single-item or small-series production;
    • screen printing for series and mass production;
  • mounting of components on the board;
  • group soldering by paste furnace melting (primary, by convection);
  • the board cleaning (washing) (depending on the flux activity) and application of protective coatings.

Individual hot-air or nitrogen soldering is also used for single-item production, equipment repair, and when mounting components requiring special precision, usually, during small-series production.

One of the critical process materials used for surface mounting is soldering paste (also sometimes known as solder paste). Soldering paste is a mix of powdered solder with organic fillers, including flux. Soldering paste is designed to:

  • act as flux (the paste contains flux)::
    • remove oxides from the solder surface;
    • reduce surface tension to improve wetting of the surface with solder;
    • improve flowing of liquid solder;
    • protect surfaces from environmental stress;
  • ensure connection between contact pads of the boards and electronic components (the paste contains solder);
  • fixate components on the board (owing to adhesive performance of the paste).

During soldering, it is essential to ensure correct temperature change in time (thermal profile), in order to:

  • prevent thermal shocks;
  • ensure good flux activation;
  • ensure good wetting of surfaces with solder.

Thermal-profile development (thermal profiling) becomes now particularly important given expansion of lead-free technology. For lead-free technology, the process window, i.e. the difference between the minimum required and minimum permissible thermal profile temperatures, is noticeably narrower due to the higher solder melting temperature.

Advantages of surface mounting

In terms of technology, surface mounting has the following advantages over the through-hole one:

  • zero or very small pin length of the components: no need for their cutting after mounting;
  • lower overall dimensions and weight of the components;
  • no need to warm solder up inside a metallized hole;
  • no need to drill holes in the board for each component;
  • both sides of the board can be used for mounting;
  • simpler and easy-to-automate mounting procedure: application of soldering paste, mounting of the component on the board, and group soldering are the process operations spread out over a period of time;
  • metal-base PCBs can be used for heat dissipation from components and electromagnetic screening.

In addition, the advantages above bring forth:

  • high mounting density owing to both lower overall dimensions of components, and lower number of holes in the board as well as lower area of contact pads;
  • improved weight and overall dimensions of the finished product;
  • improved electrical characteristics: owing to no pins and lower length of the tracks, parasitic capacitances and spurious inductances decrease, and delay in UHF signals reduces;
  • lower production cost of the finished products.

Range of mounted electronic components

Chip components from 008004 and higher, microcircuits in any of the existing packages, including DIP, SOIC, PLCC, TQFP, PQFP, TSOP, HSOP, QFP, LCC, BGA, LGA, with the maximum dimensions of packages of at least 55x100 mm and weight of up to 100 g, flip chips, surface-mounted connectors, components mounted in holes.

Technical characteristics
Parameter

Unit

Value

PCB dimensions (conveyor belt charging)

Min.

mm

50х50

Max.

mm

450х450

Min. dimensions of the mounted component

Width

mm

0,2

Length

mm

0,1

Max. dimensions of the mounted component

Width

mm

55

Length

mm

100

Height

mm

28

Min. pin pitch for components


mm

0,1

Min. pin pitch for BGA components


mm

0,1

Min. pin diameter for BGA components


mm

0,04

Mounting speed for chip components

According to IPC 9850

pcs/h

10000

Positioning accuracy for components with small pin pitch, according to IPC 9850, at 3σ

X- and Y- deviation

mm

0,025

Θ-deviation

°

0,06

ZMT LLC's Price list for SML mounting costs for 2021

Item No. Activities (services) Unit price, less VAT Q-ty of items in a one-off batch, pcs
1.1 Mounting preproduction (for each mounting side) 2 000,00 RUB -
1.2 Screen making from 7000,00 RUB -
1.3 Making one (1) soldering point at the Surface Mounting Line (SML) for commercial products 0,65 RUB 90 – 150

The price is subject to VAT (20 %).


Note:

  1. It is a single-sided mounting.
  2. Electronic components are supplied in the form of a tape, an array, in a holder block.
  3. The price includes cost of materials.

The item cost estimate formula is as follows:

Final price = q-ty of soldering points х 0.65 х K1 х K2 х K3 х K4 х K5 + cost of preparation activities + cost of screens


The factors used for the estimate are as follows:

  1. Double-sided mounting: K1=1.2 (basic=1.0).
  2. When supplying electronic components in bulk: К2=1.5 (basic=1.0).
  3. Mounting of flexible and thin boards (with thickness of 0.8 mm and lower): K3=1.5 (basic=1.0).
  4. Time-critical mounting: K4=2.0 (basic=1.0).
  5. Size of a one-off batch (basic=1.0):
    • K5=7.0 for 1 to 3 pcs
    • K5=3.0 for 4 to 30 pcs
    • K5=1.5 for 31 to 89 pcs
    • K5=0.97 for 151 to 1,000 pcs
    • K5=0.95 for 1,001 to 4,999 pcs
    • K5=0.9 for 5,000 pcs and more
Implemented Processes
We offer manufacture of your products according to the provided technical documentation.

The lead time depends on the project complexity.
Place an Order Right Away
We will call you back during the working day to discuss the details and calculate the cost of your project
Place an Order Right Away
We will call you back during the working day to discuss the details and calculate the cost of your project