The boards are fabricated on glass-ceramic, aluminium, polyimide film, ceramic, and other substrates.
The board metallization is performed by magnetron and thermal deposition with subsequent plating up.
The minimum achieved size of conductors/spacing of UHF boards is 40 µm.
Implemented Processes
➢ for resistive films based on RS-5402, RS-5406, RS-3710, K-50С alloys with the area specific resistivity of 10 Ohm/sq. to 10 kOhm/sq.;
➢ for conductive films with the Cr-Cu-Ni, Cr-Au, Cr-Cu structure (up to 12 µm-thick).
➢ minimum width of conductors and spacing: (40±5) µm;
➢ accuracy of resistor manufacture: ±1 %.
➢ up to 20.0 µm for copper;
➢ up to 1.0 µm for nickel;
➢ up to 5.0 µm for gold;
➢ up to 9.0 µm for tin-bismuth plating.
➢ by scribing;
➢ cutting with diamond blades;
➢ laser sizing and piercing.
Implemented Processes
We offer manufacture of your products according to the provided technical documentation.The lead time depends on the project complexity.
