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+7 (3412) 60-14-39
Business hours: 8 a.m. to 5 p.m.
RUS en
RUS en
+7 (3412) 60-14-39
Business hours: 8 a.m. to 5 p.m.

Thin-Film Boards

The boards are fabricated on glass-ceramic, aluminium, polyimide film, ceramic, and other substrates.
The board metallization is performed by magnetron and thermal deposition with subsequent plating up.
The minimum achieved size of conductors/spacing of UHF boards is 40 µm.
Implemented Processes
Magnetron and Thermal Deposition:
➢ for resistive films based on RS-5402, RS-5406, RS-3710, K-50С alloys with the area specific resistivity of 10 Ohm/sq. to 10 kOhm/sq.;
➢ for conductive films with the Cr-Cu-Ni, Cr-Au, Cr-Cu structure (up to 12 µm-thick).
Photolithography Based on Positive and Negative Photoresistors:
➢ minimum width of conductors and spacing: (40±5) µm;
➢ accuracy of resistor manufacture: ±1 %.
Plating Up:
➢ up to 20.0 µm for copper;
➢ up to 1.0 µm for nickel;
➢ up to 5.0 µm for gold;
➢ up to 9.0 µm for tin-bismuth plating.
Substrate Sizing:
➢ by scribing;
➢ cutting with diamond blades;
➢ laser sizing and piercing.
Implemented Processes
We offer manufacture of your products according to the provided technical documentation.

The lead time depends on the project complexity.
Place an Order Right Away
We will call you back during the working day to discuss the details and calculate the cost of your project
Place an Order Right Away
We will call you back during the working day to discuss the details and calculate the cost of your project