Fabrication of multilevel boards with up to five interconnect layers, with minimum component size and spacing of 0.1 mm, by screen printing.
Fabrication of resistive boards with the use of high- and low-temperature conductive and resistive pastes. The accuracy of resistor manufacture is ±5 %.
Fabrication of thick-film boards with metallized ends and holes with diameter of (0.3±0.1) mm.
Fabrication of conducting thick-film boards by photolithography, with the use of silver-containing pastes and the minimum component size of (0.1±0.02) mm.
Implemented Processes
We offer manufacture of your products according to the provided technical documentation.The lead time depends on the project complexity.
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We will call you back during the working day to discuss the details and calculate the cost of your project
